The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2010

Filed:

Jun. 10, 2009
Applicants:

Angelo M. Puzella, Marlborough, MA (US);

Joseph A. Licciardello, Hudson, NH (US);

Stephen J. Pereira, Hopedale, MA (US);

Joseph R. Ellsworth, Worcester, MA (US);

Inventors:

Angelo M. Puzella, Marlborough, MA (US);

Joseph A. Licciardello, Hudson, NH (US);

Stephen J. Pereira, Hopedale, MA (US);

Joseph R. Ellsworth, Worcester, MA (US);

Assignee:

Allegro Microsystems, Inc., Worcester, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01Q 1/22 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).


Find Patent Forward Citations

Loading…