The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2010

Filed:

Oct. 06, 2009
Applicants:

Yoong OH, Suwon-si, KR;

Chang-sup Ryu, Yongin-si, KR;

Dong-jin Park, Suwon-si, KR;

Jee-soo Mok, Yongin-si, KR;

Byung-bae Seo, Chungcheongbuk-do, KR;

Inventors:

Yoong Oh, Suwon-si, KR;

Chang-Sup Ryu, Yongin-si, KR;

Dong-Jin Park, Suwon-si, KR;

Jee-Soo Mok, Yongin-si, KR;

Byung-Bae Seo, Chungcheongbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.


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