The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Aug. 20, 2008
Yu-tsung Wu, Taipei, TW;
Jen-hong Huang, Kaohsiung, TW;
Chung-min Tsai, Taipei, TW;
Huan-chieh Su, Changhua County, TW;
Tri-rung Yew, Hsinchu, TW;
Yu-Tsung Wu, Taipei, TW;
Jen-Hong Huang, Kaohsiung, TW;
Chung-Min Tsai, Taipei, TW;
Huan-Chieh Su, Changhua County, TW;
Tri-Rung Yew, Hsinchu, TW;
National Tsing Hua University, Hsinchu, TW;
Abstract
A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.