The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Dec. 27, 2007
Shinji Hara, Tokyo, JP;
Koji Shimazawa, Tokyo, JP;
Yoshihiro Tsuchiya, Tokyo, JP;
Tomohito Mizuno, Tokyo, JP;
Tsuyoshi Ichiki, Tokyo, JP;
Toshiyuki Ayukawa, Tokyo, JP;
Shinji Hara, Tokyo, JP;
Koji Shimazawa, Tokyo, JP;
Yoshihiro Tsuchiya, Tokyo, JP;
Tomohito Mizuno, Tokyo, JP;
Tsuyoshi Ichiki, Tokyo, JP;
Toshiyuki Ayukawa, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
In an MR element, first and second ferromagnetic layers are antiferromagnetically coupled to each other through a spacer layer, and have magnetizations that are in opposite directions when no external magnetic field is applied thereto and that change directions in response to an external magnetic field. The spacer layer and the second ferromagnetic layer are stacked in this order on the first ferromagnetic layer. The first ferromagnetic layer includes a plurality of ferromagnetic material layers stacked, and an insertion layer made of a nonmagnetic material and inserted between respective two of the ferromagnetic material layers that are adjacent to each other along the direction in which the layers are stacked. The ferromagnetic material layers and the spacer layer each include a component whose crystal structure is a face-centered cubic structure. The spacer layer and the insertion layer are each composed of an element having an atomic radius greater than that of at least one element constituting the ferromagnetic material layers.