The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Mar. 22, 2007
Eisaku Maeda, Osaka, JP;
Hiroshi Ando, Osaka, JP;
Jinsaku Kaneda, Osaka, JP;
Akihiro Maejima, Osaka, JP;
Hiroki Matsunaga, Osaka, JP;
Eisaku Maeda, Osaka, JP;
Hiroshi Ando, Osaka, JP;
Jinsaku Kaneda, Osaka, JP;
Akihiro Maejima, Osaka, JP;
Hiroki Matsunaga, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a semiconductor integrated circuit device of the present invention, temperature increase of a bonding wire can be suppressed even when conductive leads are short-circuited with each other, and reliability of the semiconductor integrated circuit device is improved. The conductive leads of a resin package for supplying a power supply section of a semiconductor integrated circuit chip with power from an external power supply are connected with bonding pads of the semiconductor integrated circuit chip by a plurality of bonding wires. Furthermore, the conductive leads connected to a GND for supplying the power supply section of the semiconductor integrated circuit chip with a grounding potential are connected with the bonding pads of the semiconductor integrated circuit chip by a plurality of bonding wires.