The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Jun. 29, 2007
Toshiki Hara, Suwa, JP;
Toshiki Hara, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor apparatus, the method including: aligning, on a temporal substrate, the plurality of device chips approximately in an L-shape, a plurality of groups of device chips, each group of device chips including a plurality of device chips aligned in an L-shape; arranging the plurality of groups of the device chips in a plurality of arrays on the temporal substrate, each array of device chips arranged in a band-shape, from a first long side to a second long side of the temporal substrate, a front of the band-shape being a corner of a perimeter of each group; delaminating a group of the device chips as one unit from the temporal substrate, and transferring onto the surface of the flexible substrate; and coupling each of the device chips in the group of device chips with the circuit on the flexible substrate.