The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2010

Filed:

Dec. 21, 2006
Applicants:

Errol P. Akomer, Plano, TX (US);

James Bright, Rockwall, TX (US);

Mohammad Nikpour, Plano, TX (US);

Jason Tervooren, Allen, TX (US);

Kyle Flessner, Richardson, TX (US);

Inventors:

Errol P. Akomer, Plano, TX (US);

James Bright, Rockwall, TX (US);

Mohammad Nikpour, Plano, TX (US);

Jason Tervooren, Allen, TX (US);

Kyle Flessner, Richardson, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a method for manufacturing an integrated circuit. The method, in one embodiment, includes inspecting a semiconductor wafer including a plurality of die for a defect, the inspecting providing an image of the semiconductor wafer including the defect. The method further includes identifying an area of the semiconductor wafer from the image, wherein the identified area encompasses at least those die including any portion of the defect, and dicing the semiconductor wafer into individual die. The die defined by the identified area, in this embodiment, are then discarded.


Find Patent Forward Citations

Loading…