The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Jun. 15, 2007
Akifumi Kamijima, Tokyo, JP;
Atsushi Yamaguchi, Tokyo, JP;
Masahiro Saito, Tokyo, JP;
Shingo Miyata, Tokyo, JP;
Yuji Otsubo, Tokyo, JP;
Souhei Horiuchi, Tokyo, JP;
Akifumi Kamijima, Tokyo, JP;
Atsushi Yamaguchi, Tokyo, JP;
Masahiro Saito, Tokyo, JP;
Shingo Miyata, Tokyo, JP;
Yuji Otsubo, Tokyo, JP;
Souhei Horiuchi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.