The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Nov. 15, 2007
Tso-hung Yeh, Taoyuan, TW;
Hsiao-chun Huang, Taoyuan, TW;
Chun-ta Huang, Taoyuan, TW;
Meng-hung Wu, Taoyuan, TW;
Tso-Hung Yeh, Taoyuan, TW;
Hsiao-Chun Huang, Taoyuan, TW;
Chun-Ta Huang, Taoyuan, TW;
Meng-Hung Wu, Taoyuan, TW;
Foxconn Advanced Technology Inc., Tayuan, Taoyuan, TW;
Abstract
An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.