The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2010

Filed:

Feb. 16, 2007
Applicants:

Takashi Yoshino, Ama-Gun, JP;

Shoichiro Yamaguchi, Ichinomiya, JP;

Yuichi Iwata, Nagoya, JP;

Akira Hamajima, Nagoya, JP;

Kengo Suzuki, Komaki, JP;

Inventors:

Takashi Yoshino, Ama-Gun, JP;

Shoichiro Yamaguchi, Ichinomiya, JP;

Yuichi Iwata, Nagoya, JP;

Akira Hamajima, Nagoya, JP;

Kengo Suzuki, Komaki, JP;

Assignees:

NGK Insulators, Ltd., Nagoya-shi, JP;

NGK Optoceramics Co., Ltd., Komaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a piezoelectric thin film device of the present invention, the degree of flexibility is enhanced in selection of a piezoelectric material constituting a piezoelectric thin film and the crystal orientation in the piezoelectric thin film. A piezoelectric thin film filter, including four film bulk acoustic resonators, has a configuration where a filter section for providing a filter function of the piezoelectric thin film filter is bonded with a flat base substrate mechanically supporting the filter section via an adhesive layer. In manufacturing of the piezoelectric thin film filter, a piezoelectric thin film is obtained by performing removal processing on a piezoelectric substrate, but the piezoelectric thin film obtained by removal processing cannot independently stand up under its own weight. For this reason, a prescribed member including the piezoelectric substrate is previously bonded to the base substrate as a support prior to the removal processing.


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