The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7852900 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 14, 2010

Filed:

Dec. 11, 2008
Applicants:

Isao Hayami, Hyogo, JP;

Masaya Tateyanagi, Shiga, JP;

Inventors:

Isao Hayami, Hyogo, JP;

Masaya Tateyanagi, Shiga, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/08 (2006.01); H01L 23/12 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A caphaving a piece of glassformed at a laser irradiating position and covering a laser irradiating direction and an upper face of a package, is mounted onto the packagehaving lateral faces of a frame bodyformed in three directions other than the laser irradiating direction, so as to reduce the distance between a semiconductor elementand the piece of glassand to reduce a radiusof the piece of glass. The profile of the semiconductor device can be therefore lowered while maintaining the characteristics of a semiconductor laser. In addition, by mounting the semiconductor device, the profile of an optical pickup device can also be lowered.


Find Patent Forward Citations

Hayami, Isao. (2010). Semiconductor device, method of manufacturing the same, and production equipment of the same (U.S. Patent No. 7852900). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7852900

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