The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Dec. 05, 2007
Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
Yukihiro Kozaka, Kyoto, JP;
Yoshifumi Nakamura, Osaka, JP;
Michinari Tetani, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device of the present invention includes: a wiring boardin which a conductive wiringis formed on an insulating substratehaving an opening; a semiconductor elementthat has a circuit forming regionand an electrode pad, and is mounted on the wiring board with the circuit forming region facing the opening, the electrode pad being connected electrically to the conductive wiring via a protruding electrode; a sealing resinthat covers the connected portion between the electrode pad and the conductive wiring; a heat dissipating memberthat is disposed so as to have a portion facing the opening; and a filling materialthat has a heat conductivity higher than that of the sealing resin, and is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member. Even when the wiring board has a small area, heat dissipation efficiency can be ensured, and low cost manufacture can be achieved.