The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2010

Filed:

Jun. 25, 2007
Applicants:

Jun Futakuchiya, Isehara, JP;

Toshihiro Tachikawa, Isehara, JP;

Inventors:

Jun Futakuchiya, Isehara, JP;

Toshihiro Tachikawa, Isehara, JP;

Assignee:

NHK Spring Co., Ltd, Yokohama-shi, Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a heater unit which can improve temperature uniformity of a heated object at the time of heating the object. A second heat conductorwhich is the radial internal part of shafthas a lower heat transfer ratio than a first heat conductorwhich is the radial external part of shaft. As a result, in the case where a heated state and a non heated state of the resistance heating elementare repeatedly switched, the movement of heat from the front partB of the shaftto the base point partA is suppressed by the second heat conductorcompared to the first heat conductor. As a result, in the part which confronts the hollow partof the shaftin the heater plate, the time required to heat the heater plateand the waferto be heated to a desired heating temperature is shortened when compared to a conventional heater unit. Therefore, it is possible to improve the uniformity of the temperature of the waferwhich is to be heated by the heater plate


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