The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2010

Filed:

Sep. 04, 2007
Applicant:

Shu Hsien Liao, Taipei, TW;

Inventor:

Shu Hsien Liao, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A waterproof and dustproof structure is applied to a predetermined hole of a circuit board. A connection end of a connector could penetrate the predetermined hole. Moreover, the circuit board has a first surface and a second surface. The waterproof and dustproof structure can cover up the predetermined hole to isolate the first surface and the second surface. The interferences on the first surface may not move to the second surface through the predetermined hole. Therefore, when the connection end of the connector passes through the predetermined hole, the predetermined hole on the circuit board can be sealed via the waterproof and dustproof structure so as to achieve the goal of waterproof and dust prevention.


Find Patent Forward Citations

Liao, Shu. (2010). Waterproof and dustproof structure (U.S. Patent No. 7851710). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7851710

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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