The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Mar. 09, 2009
Mutsumi Masumoto, Beppu, JP;
Mutsumi Masumoto, Beppu, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The objective of the invention is to provide a semiconductor device manufacturing method with which the generation of burrs can be suppressed while increasing the singulation speed of the package. In a manufacturing method of a QFN package of the present invention, a molding prepared by sealing a lead frame with plural semiconductor chips carried on it en bloc with a resin; the operation comprises the following processing steps: a first singulation processing step Sin which the molding is half-cut along the cutting plane; a de-flashing processing step Sin which the burrs on the cut portion of the half-cut molding are removed; and a second singulation processing step Sin which the de-flashed molding is completely cut along the cutting plane.