The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7851137 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 14, 2010

Filed:

Sep. 06, 2006
Applicant:

Hideki Oguma, Yokohama, JP;

Inventor:

Hideki Oguma, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are provided a semiconductor device manufacturing method including: forming a film to be processed above a substrate; forming a resist layer above the film to be processed; transferring a transfer pattern to the resist layer using a reticle including the transfer pattern having a space having a width that becomes narrower than a smallest processing space width when transferred to the resist layer; performing trimming processing on the resist layer including the transfer pattern as transferred; and patterning the film to be processed using the resist layer, on which the trimming processing has been performed, as a mask.


Find Patent Forward Citations

Oguma, Hideki. (2010). Method of manufacturing semiconductor device (U.S. Patent No. 7851137). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7851137

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