The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Sep. 28, 2006
Gary Stevens, Surry, GB;
James D. B. Smith, Monroeville, PA (US);
John W. Wood, Winter Springs, FL (US);
Gary Stevens, Surry, GB;
James D. B. Smith, Monroeville, PA (US);
John W. Wood, Winter Springs, FL (US);
Siemens Energy, Inc., Orlando, FL (US);
Abstract
A high thermal conductivity resin that is made up of a host resin matrix () and high thermal conductivity fillers () that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell () around the high thermal conductivity fillers (), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells () is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.