The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Mar. 18, 2005
Hiroyuki Sasai, Kyoto, JP;
Hiroyuki Sasai, Kyoto, JP;
Shimadzu Corporation, Kyoto-shi, Kyoto, JP;
Abstract
An arrangement is made such that the magnitude of cure shrinkage obtained by multiplying the thickness of a resin layerbetween a master moldand a negative mold substrateby the cure shrinkage ratio of the resin and the magnitude of cure shrinkage obtained by multiplying the thickness of a resin layerbetween the negative moldand the surface of the spherical or flat substrateby the cure shrinkage ratio of the resin can be compensated for by each other. In accordance with this method, an aspherical optical element having a higher precision than ever can be formed at reduced cost by a replica method involving the addition of a resin layer to the surface of a spherical or flat substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile