The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7850815 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 14, 2010

Filed:

May. 15, 2007
Applicants:

Takuya Kaizu, Ryugasaki, JP;

Hiroaki Imai, Ryugasaki, JP;

Masayuki Saito, Tsukubamirai, JP;

Inventors:

Takuya Kaizu, Ryugasaki, JP;

Hiroaki Imai, Ryugasaki, JP;

Masayuki Saito, Tsukubamirai, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B31B 1/60 (2006.01); B32B 37/00 (2006.01); B32B 17/00 (2006.01); C03C 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A technique which solves the problem of conventional laminating apparatuses that a substrate may be deformed when released by pushing lift pins against the substrate held on an adhesive member by suction. An upper table inside a chamber has, on its substrate holding face, an elastic plate provided with an elastic body, a vacuum suction means and a purge gas blow means. A plurality of adhesive pins are provided on an adhesive pin plate which can move up and down independently from the upper table. The upper table and the elastic plate have through holes through which the adhesive pins can move and the adhesive pins have adhesion means at their tips.


Find Patent Forward Citations

Kaizu, Takuya. (2010). Substrate assembling apparatus and substrate assembling method using the same (U.S. Patent No. 7850815). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7850815

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