The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Aug. 24, 2007
Shoko Omizo, Kanagawa-ken, JP;
Atsushi Yoshimura, Kanagawa-ken, JP;
Mitsuhiro Nakao, Kanagawa-ken, JP;
Junya Sagara, Kanagawa-ken, JP;
Masayuki Dohi, Kanagawa-ken, JP;
Tatsuhiko Shirakawa, Tokyo, JP;
Shoko Omizo, Kanagawa-ken, JP;
Atsushi Yoshimura, Kanagawa-ken, JP;
Mitsuhiro Nakao, Kanagawa-ken, JP;
Junya Sagara, Kanagawa-ken, JP;
Masayuki Dohi, Kanagawa-ken, JP;
Tatsuhiko Shirakawa, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.