The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Oct. 13, 2006
Masahiro Okamoto, Sakura, JP;
Shouji Itou, Sakura, JP;
Osamu Nakao, Sakura, JP;
Takanao Suzuki, Sakura, JP;
Satoshi Okude, Sakura, JP;
Masahiro Okamoto, Sakura, JP;
Shouji Itou, Sakura, JP;
Osamu Nakao, Sakura, JP;
Takanao Suzuki, Sakura, JP;
Satoshi Okude, Sakura, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion. According to the invention, therefore, it is allowed to provide a multi-layer printed wing board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.