The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Jul. 31, 2007
Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
Kadthala Ramaya Narendranath, San Jose, CA (US);
Dmitry Lubomirsky, Cupertino, CA (US);
Xinglong Chen, San Jose, CA (US);
Sudhir Goodhalekar, Fremont, CA (US);
Muhammad Rasheed, Fremont, CA (US);
Tony Kaushal, Cupertino, CA (US);
Kadthala Ramaya Narendranath, San Jose, CA (US);
Dmitry Lubomirsky, Cupertino, CA (US);
Xinglong Chen, San Jose, CA (US);
Sudhir Goodhalekar, Fremont, CA (US);
Muhammad Rasheed, Fremont, CA (US);
Tony Kaushal, Cupertino, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method and apparatus for providing a fluid distribution element for an electrostatic chuck that reduces plasma formation and arcing within heat transfer fluid passages. One embodiment comprises a plate and a dielectric component, where the dielectric component is inserted into the plate. The plate is adapted to be positioned within a channel to define a plenum, wherein the dielectric component provides at least a portion of a fluid passage coupled to the plenum. A porous dielectric layer, formed upon the dielectric component, provides at least another portion of a fluid passage coupled to the plenum. In other embodiments, the fluid distribution element comprises various arrangements of components to define a fluid passage that does not provide a line-of-sight path from the support surface for a substrate to a plenum.