The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7847403 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 07, 2010

Filed:

Jun. 01, 2007
Applicants:

Sang Hyun Yi, Suwon, KR;

Young Nam Kim, Suwon, KR;

Inventors:

Sang Hyun Yi, Suwon, KR;

Young Nam Kim, Suwon, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon, Kyungki-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device and a method of manufacturing the same which yields high reliability and a high manufacturing yield. The semiconductor device includes a metal line layer having a plurality of metal line patterns spaced apart from each other, and at least one underlying layer under the metal line layer, wherein the space between two adjacent metal line patterns has a sufficient width to prevent a crack from occurring in one or more of the underlying layers. The cracking of an underlying layer may also be prevented by providing a slit in a direction parallel to the space between two adjacent metal line patterns at a sufficient distance from the space between the two adjacent metal line patterns.


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Yi, Sang. (2010). Semiconductor device having no cracks in one or more layers underlying a metal line layer (U.S. Patent No. 7847403). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7847403

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