The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Aug. 21, 2008
Sung-hwan Yoon, Chungcheongnam-do, KR;
Sung-Hwan Yoon, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Embodiments of the inventive concept provide a semiconductor chip stack-type package. The package comprises a lead frame including a die paddle part and a lead part, a first semiconductor chip group and a second semiconductor chip group stacked sequentially and mounted on one surface of the die paddle part, a first wiring board between the first semiconductor chip group and the second semiconductor chip group, and second semiconductor chip group bonding wires for electrically connecting the second semiconductor chip group to the first wiring board. End portions of the first wiring board are electrically connected to inner leads of the lead part, which is adjacent to the die paddle part.