The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Jun. 25, 2008
Mituharu Tabata, Tokyo, JP;
Mituharu Tabata, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a semiconductor module case; a metal terminal externally extending from within the case; a semiconductor element disposed within the case and electrically connected to the metal terminal; and a printed wiring board having a wiring pattern formed on a surface thereof, the printed wiring board being connected to the semiconductor element through the metal terminal; wherein the external portion of the metal terminal includes a joining portion and a resilient portion, the joining portion being in surface contact with an external surface of the case, the resilient portion facing and being spaced from the joining portion; wherein the printed wiring board is inserted between the joining portion and the resilient portion; and wherein the wiring pattern on the printed wiring board is pressure-welded to the joining portion.