The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Feb. 27, 2006
Mitsuhiko Ogihara, Takasaki, JP;
Masataka Muto, Takasaki, JP;
Tomoki Igari, Takasaki, JP;
Takahito Suzuki, Takasaki, JP;
Mitsuhiko Ogihara, Takasaki, JP;
Masataka Muto, Takasaki, JP;
Tomoki Igari, Takasaki, JP;
Takahito Suzuki, Takasaki, JP;
Oki Data Corporation, Tokyo, JP;
Abstract
A semiconductor composite apparatus includes a substrate and a planarizing layer, and a semiconductor thin film. The planarizing layer is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate, and a second surface that is on the side of the planarizing layer remote from the substrate. The semiconductor thin film formed on the planarizing layer. The second surface has a roughness of not more than 5 nm.