The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2010

Filed:

Aug. 30, 2006
Applicants:

Tomoko Fukunaka, Shiga, JP;

Masashi Ishiguro, Hyogo, JP;

Kenji Takahashi, Osaka, JP;

Shinsuke Kurahashi, Hyogo, JP;

Michio Sakurai, Osaka, JP;

Inventors:

Tomoko Fukunaka, Shiga, JP;

Masashi Ishiguro, Hyogo, JP;

Kenji Takahashi, Osaka, JP;

Shinsuke Kurahashi, Hyogo, JP;

Michio Sakurai, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); B23K 26/20 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.


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