The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2010

Filed:

Mar. 23, 2007
Applicants:

Anna Lee Tonkovich, Dublin, OH (US);

Kai Tod Paul Jarosch, Bexley, OH (US);

Bin Yang, Columbus, OH (US);

Francis P. Daly, Delaware, OH (US);

Thomas P. Hickey, Dublin, OH (US);

Jeffrey Marco, South Charleston, OH (US);

Timothy J. Laplante, Columbus, OH (US);

Richard Q. Long, New Albany, OH (US);

Inventors:

Anna Lee Tonkovich, Dublin, OH (US);

Kai Tod Paul Jarosch, Bexley, OH (US);

Bin Yang, Columbus, OH (US);

Francis P. Daly, Delaware, OH (US);

Thomas P. Hickey, Dublin, OH (US);

Jeffrey Marco, South Charleston, OH (US);

Timothy J. LaPlante, Columbus, OH (US);

Richard Q. Long, New Albany, OH (US);

Assignee:

Velocys, Inc., Plain City, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07C 2/66 (2006.01); C07C 5/333 (2006.01);
U.S. Cl.
CPC ...
Abstract

The disclosed invention relates to a process for converting ethylbenzene to styrene, comprising: flowing a feed composition comprising ethylbenzene in at least one process microchannel in contact with at least one catalyst to dehydrogenate the ethylbenzene and form a product comprising styrene; exchanging heat between the process microchannel and at least one heat exchange channel in thermal contact with the process microchannel; and removing product from the process microchannel. Also disclosed is an apparatus comprising a process microchannel, a heat exchange channel, and a heat transfer wall positioned between the process microchannel and heat exchange channel wherein the heat transfer wall comprises a thermal resistance layer.


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