The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2010

Filed:

Jun. 20, 2008
Applicants:

Ryohei Satoh, Osaka, JP;

Koji Nakagawa, Osaka, JP;

Reo Usui, Osaka, JP;

Kenji Tanaka, Tokyo, JP;

Satoru Takaki, Tokyo, JP;

Kenichi Ebata, Tokyo, JP;

Yumiko Aoki, Tokyo, JP;

Inventors:

Ryohei Satoh, Osaka, JP;

Koji Nakagawa, Osaka, JP;

Reo Usui, Osaka, JP;

Kenji Tanaka, Tokyo, JP;

Satoru Takaki, Tokyo, JP;

Kenichi Ebata, Tokyo, JP;

Yumiko Aoki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of fromto° C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.


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