The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2010

Filed:

Mar. 17, 2008
Applicants:

Sarkis Minas Keshishian, Balmain, AU;

Susan Williams, Balmain, AU;

Paul Andrew Papworth, Balmain, AU;

Kia Silverbrook, Balmain, AU;

Inventors:

Sarkis Minas Keshishian, Balmain, AU;

Susan Williams, Balmain, AU;

Paul Andrew Papworth, Balmain, AU;

Kia Silverbrook, Balmain, AU;

Assignee:

Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.


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