The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Dec. 10, 2007
IN Hyung Lee, Seoul, KR;
Yul Kyo Chung, Gyunggi-do, KR;
Bae Kyun Kim, Gyunggi-do, KR;
Seung Eun Lee, Gyunggi-do, KR;
Jung Won Lee, Seoul, KR;
In Hyung Lee, Seoul, KR;
Yul Kyo Chung, Gyunggi-do, KR;
Bae Kyun Kim, Gyunggi-do, KR;
Seung Eun Lee, Gyunggi-do, KR;
Jung Won Lee, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Abstract
A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.