The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Feb. 14, 2008
Brett C. Baker-o'neal, Sleepy Hollow, NY (US);
Cyril Cabral, Jr., Mahopac, NY (US);
Qiang Huang, Sleepy Hollow, NY (US);
Kenneth P. Rodbell, Sandy Hook, CT (US);
Brett C. Baker-O'Neal, Sleepy Hollow, NY (US);
Cyril Cabral, Jr., Mahopac, NY (US);
Qiang Huang, Sleepy Hollow, NY (US);
Kenneth P. Rodbell, Sandy Hook, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Cobalt is added to a copper seed layer, a copper plating layer, or a copper capping layer in order to modify the microstructure of copper lines and vias. The cobalt can be in the form of a copper-cobalt alloy or as a very thin cobalt layer. The grain boundaries configured in bamboo microstructure in the inventive metal interconnect structure shut down copper grain boundary diffusion. The composition of the metal interconnect structure after grain growth contains from about 1 ppm to about 10% of cobalt in atomic concentration. Grain boundaries extend from a top surface of a copper-cobalt alloy line to a bottom surface of the copper-cobalt alloy line, and are separated from any other grain boundary by a distance greater than a width of the copper-cobalt alloy line.