The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Mar. 23, 2009
Yoshihiko Shimanuki, Nanyo, JP;
Yoshihiro Suzuki, Yonezawa, JP;
Koji Tsuchiya, Kaminoyama, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
There are constituted by a tab () on which a semiconductor chip () is mounted, a sealing portion () formed by resin-sealing the semiconductor chip (), a plurality of leads () each having a mounted surface () exposed to a peripheral portion of a rear surface () of the sealing portion () and a sealing-portion forming surface () disposed on an opposite side thereto, and a wire () for connecting a pad () of the semiconductor chip () and a lead (), wherein the length (M) between inner ends () of the sealing-portion forming surfaces () of the leads () disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends () of the mounted surfaces (). Thereby, a chip mounting region surrounded by the inner end () of the sealing-portion forming surface () of each lead () can be expanded and the size of the mountable chip is increased.