The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Sep. 06, 2006
James Reginelli, Parma, OH (US);
Srinath K. Aanegola, Broadview Heights, OH (US);
Emil Radkov, Euclid, OH (US);
James Reginelli, Parma, OH (US);
Srinath K. Aanegola, Broadview Heights, OH (US);
Emil Radkov, Euclid, OH (US);
Lumination LLC, Cleveland, OH (US);
Abstract
In a light emitting package (), at least one light emitting chip () is supported by a board (). A light transmissive encapsulant () is disposed over the at least one light emitting chip and over a footprint area () of the board. A light transmissive generally conformal shell () is disposed over the encapsulant and has an inner surface () spaced apart by an air gap (G) from, and generally conformal with, an outer surface () of the encapsulant. At least one phosphor () is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell () is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).