The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
May. 16, 2006
Wilhelm Leneke, Dresden, DE;
Marion Simon, Bad Schwalbach, DE;
Mischa Schulze, Meissen, DE;
Karlheinz Storck, Pesterwitz, DE;
Joerg Schieferdecker, Dresden, DE;
Wilhelm Leneke, Dresden, DE;
Marion Simon, Bad Schwalbach, DE;
Mischa Schulze, Meissen, DE;
Karlheinz Storck, Pesterwitz, DE;
Joerg Schieferdecker, Dresden, DE;
Heimann Sensor GmbH, Dresden, DE;
Abstract
A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.