The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7842891 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 30, 2010

Filed:

Jan. 20, 2006
Applicants:

Takao Kasai, Nagano, JP;

Haruyuki Hiratsuka, Nagano, JP;

Inventors:

Takao Kasai, Nagano, JP;

Haruyuki Hiratsuka, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a sealing board () for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal () and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal () is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively.


Find Patent Forward Citations

Kasai, Takao. (2010). Sealing board and method for producing the same (U.S. Patent No. 7842891). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7842891

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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