The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Nov. 18, 2005
Fulvio Federico, Piacenza, IT;
Leonello Carrettin, Milan, IT;
Dario Oldani, Milan, IT;
Corrado Mojana, Valmadrera, IT;
Fulvio Federico, Piacenza, IT;
Leonello Carrettin, Milan, IT;
Dario Oldani, Milan, IT;
Corrado Mojana, Valmadrera, IT;
Uhdenora S.p.A., Milan, IT;
Abstract
It is described a bipolar plate consisting of a single wall and a perimetrical sealing frame obtained by folding and provided with a planar abutment surface for the frame-to-wall welding. The wall is further provided with projections on one face thereof preferably obtained by moulding, and with supports on the other face consisting of sheet strips housed in the recesses formed by the concave part of the projections. The projections substantially extend along the entire length of the bipolar plate. The projections and supports are connected to electrodes or current distributors. The projections, the supports, the single wall and the perimetrical frame are made of the same metal or alloy. The electrode or current distributor supported by the projections, the same projections and the supports are welded together by a single pass of arc-welding or preferably laser-welding. The electrode or current distributor connected to the support and the support themselves are mutually welded by a subsequent pass of arc-welding or preferably laser-welding. The welding between wall and perimetrical frame on the abutment surface of the frame is carried out by diode-laser technique, allowing to obtain a robust connection but without a complete melting of the sheet, thereby eliminating the risk of process fluid leakage to the external environment.