The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Aug. 29, 2007
Tak K. Wang, Saratoga, CA (US);
Tak K. Wang, Saratoga, CA (US);
Avago Technologies Fiber IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
In an optical transceiver module, the bottom surface of the lid is temporarily attached to the top surface of the submount assembly in a pre-alignment position prior to performing the solder flowing process in order to prevent the lid from shifting position during the solder flowing process. The solder flowing process is then performed to melt the solder. When the solder melts, the surface tension of the melted solder pulls the lid into its ultimate, or permanent, aligned position. The solder is then cooled, causing it to harden, thereby securing the lid to the submount assembly in its ultimate, permanently aligned position. The hardened solder between the top surface of the submount assembly and the bottom surface of the lid forms a hermetic seal that encloses components on the transmit side of the transceiver module in a hermetically-sealed environment.