The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2010

Filed:

Dec. 30, 2008
Applicants:

Wen-chin Lee, Taoyuan, TW;

Cheng-hsien Lin, Taoyuan, TW;

Inventors:

Wen-Chin Lee, Taoyuan, TW;

Cheng-Hsien Lin, Taoyuan, TW;

Assignee:

Foxconn Advanced Technology, Inc., Tayuan, Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.


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Lee, Wen-Chin. (2010). Insulating film, printed circuit board substrate and printed circuit board including same (U.S. Patent No. 7839647). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7839647

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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