The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Aug. 19, 2009
Tomoo Hayashi, Hitachinaka, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Yoshihiro Kondo, Tsuchiura, JP;
Hiroyuki Toyoda, Hitachinaka, JP;
Akio Idei, Hadano, JP;
Shigeyasu Tsubaki, Odawara, JP;
Tomoo Hayashi, Hitachinaka, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Yoshihiro Kondo, Tsuchiura, JP;
Hiroyuki Toyoda, Hitachinaka, JP;
Akio Idei, Hadano, JP;
Shigeyasu Tsubaki, Odawara, JP;
Hitachi, Ltd, Tokyo, JP;
Abstract
An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.