The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2010

Filed:

Jul. 28, 2010
Applicants:

Mahendra P. Mathur, Pittsburgh, PA (US);

James L. Spenik, Morgantown, WV (US);

Christopher M. Condon, Morgantown, WV (US);

Rodney Anderson, Grafton, WV (US);

Daniel J. Driscoll, Morgantown, WV (US);

William L. Fincham, Jr., Fairmont, WV (US);

Esmail R. Monazam, Morgantown, WV (US);

Inventors:

Mahendra P. Mathur, Pittsburgh, PA (US);

James L. Spenik, Morgantown, WV (US);

Christopher M. Condon, Morgantown, WV (US);

Rodney Anderson, Grafton, WV (US);

Daniel J. Driscoll, Morgantown, WV (US);

William L. Fincham, Jr., Fairmont, WV (US);

Esmail R. Monazam, Morgantown, WV (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G08B 13/26 (2006.01); G08B 21/00 (2006.01); G01R 31/08 (2006.01); G01R 27/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

The disclosure relates to analysis of materials using a capacitive sensor to detect anomalies through comparison of measured capacitances. The capacitive sensor is used in conjunction with a capacitance measurement device, a location device, and a processor in order to generate a capacitance versus location output which may be inspected for the detection and localization of anomalies within the material under test. The components may be carried as payload on an inspection vehicle which may traverse through a pipe interior, allowing evaluation of nonmetallic or plastic pipes when the piping exterior is not accessible. In an embodiment, supporting components are solid-state devices powered by a low voltage on-board power supply, providing for use in environments where voltage levels may be restricted.


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