The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Jan. 18, 2007
Craig Damon Hillman, Bethesda, MD (US);
Nathan John Blattau, Waldorf, MD (US);
Danko Dmitrievich Priimak, Gaithersburg, MD (US);
Craig Damon Hillman, Bethesda, MD (US);
Nathan John Blattau, Waldorf, MD (US);
Danko Dmitrievich Priimak, Gaithersburg, MD (US);
DfR Solutions, LLC, College Park, MD (US);
Abstract
Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.