The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Jul. 05, 2006
Jose Joel Dimasacat, Pasig, PH;
Jerry Lutiva Tan, Calamba, PH;
Willem Dirk Van Driel, Den Bosch, NL;
Jose Joel Dimasacat, Pasig, PH;
Jerry Lutiva Tan, Calamba, PH;
Willem Dirk Van Driel, Den Bosch, NL;
NXP B.V., Eindhoven, NL;
Abstract
A semi-conductor device () comprises an exposed leadframe () with a die pad () and a plurality of leads (). The die pad () has a substantially flat bottom surface () and a top surface (). A semi-conductor die () is attached to a die attachment portion () of the top surface (). Downbonds () connect the die () to a downbond attachment portion (). Standard bonds () connect the die () to the leads (). A plastic package () encapsulates the die (), the standard bonds () and the downbonds (). The top surface of the die pad has portions located at different levels, and step-shaped transitions between two adjacent ones of such portions. At least one of such step-shaped transition () is located between the die () and the downbonds (). It has been found that such step-shaped transition provides good protection against downbond failure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile