The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Jun. 15, 2006
Shintaro Yamamichi, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Takuo Funaya, Tokyo, JP;
Takehiko Maeda, Kanagawa, JP;
Kenta Ogawa, Kanagawa, JP;
Jun Tsukano, Kanagawa, JP;
Hirokazu Honda, Kanagawa, JP;
Shintaro Yamamichi, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Takuo Funaya, Tokyo, JP;
Takehiko Maeda, Kanagawa, JP;
Kenta Ogawa, Kanagawa, JP;
Jun Tsukano, Kanagawa, JP;
Hirokazu Honda, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.