The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Dec. 19, 2006
Satoru Yamada, Mie, JP;
Kei Inatomi, Yokkaichi, JP;
Yasutake Wakabayashi, Shunan, JP;
Shigehiko Abe, Yokkaichi, JP;
Morihiko Sato, Yokkaichi, JP;
Masao Tanabiki, Yokkaichi, JP;
Satoshi Hamura, Yokkaichi, JP;
Ryuji Ikeda, Yokkaichi, JP;
Satoru Yamada, Mie, JP;
Kei Inatomi, Yokkaichi, JP;
Yasutake Wakabayashi, Shunan, JP;
Shigehiko Abe, Yokkaichi, JP;
Morihiko Sato, Yokkaichi, JP;
Masao Tanabiki, Yokkaichi, JP;
Satoshi Hamura, Yokkaichi, JP;
Ryuji Ikeda, Yokkaichi, JP;
Tosoh Corporation, Shunan-Shi, JP;
Abstract
An object of the present invention relates to provide an ethylene polymer having excellent mechanical strength and excellent molding processability in a wide molding processing temperature range. The invention relates to use an ethylene polymer comprising a repeating unit derived from ethylene, or a repeating unit derived from ethylene and a repeating unit derived from a Cα-olefin, the ethylene polymer being satisfied with the following (A) to (F). (A) Density (d (kg/m)) is from 910 to 970, (B) MFR (g/10 min)) is from 0.01 to 50, (C) terminal vinyl number is 0.2 or less per 1,000 carbon atoms, (D) melt strength (MS(mN)) measured at 160° C. and MFR are satisfied with MS>90−130×log(MFR), (E) melt strength (MS(mN)) measured at 190° C. and MSare satisfied with MS/MS<1.8, and (F) fluidized activation energy (E(kJ/mol)) and d are satisfied with 127−0.107d<E<88−0.060d.