The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Oct. 24, 2008
Applicants:
Hiroshi Tomita, Yokohama, JP;
Hiroyasu Iimori, Yokohama, JP;
Hisashi Okuchi, Yokohama, JP;
Tatsuhiko Koide, Yokohama, JP;
Linan Ji, Yokohama, JP;
Inventors:
Hiroshi Tomita, Yokohama, JP;
Hiroyasu Iimori, Yokohama, JP;
Hisashi Okuchi, Yokohama, JP;
Tatsuhiko Koide, Yokohama, JP;
Linan Ji, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of treating the surface of a semiconductor substrate has cleaning the semiconductor substrate having a pattern formed thereon by using a chemical solution, removing the chemical solution by using pure water, forming a water repellent protective film on the surface of the semiconductor substrate, rinsing the semiconductor substrate by using pure water, and drying the semiconductor substrate.