The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2010

Filed:

Jun. 27, 2008
Applicants:

Naoki Hirao, Kanagawa, JP;

Yasunobu Iwakoshi, Tokyo, JP;

Katsuhiro Tomoda, Kanagawa, JP;

Huy Sam, Tokyo, JP;

Inventors:

Naoki Hirao, Kanagawa, JP;

Yasunobu Iwakoshi, Tokyo, JP;

Katsuhiro Tomoda, Kanagawa, JP;

Huy Sam, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base; and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fixing member precursor layer, and then heating the conductive fixing member precursor layer to form a conductive fixing member latter, thereby fixing the connecting portion of the element to the wiring, with the conductive fixing member layer therebetween, wherein the conductive fixing member precursor layer is composed of a solution-tape conductive material.


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