The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Feb. 15, 2007
Norihiko Kaneko, Fussa, JP;
Norihiko Kaneko, Fussa, JP;
Casio Computer Co., Ltd., Tokyo, JP;
Abstract
A semiconductor substrate in a wafer state having one surface provided thereon a plurality of external connection electrodes is stacked onto a support film. The wafer-state semiconductor substrate stuck on the support film is cut into a plurality of chip size semiconductor substrates, whereby the adjacent semiconductor substrates are separated from each other, and each semiconductor substrate is provided with at least one of the external connection electrodes. At least one protection film is formed on the other surface of the chip size semiconductor substrates, and on a peripheral side surface thereof that the chip size semiconductor substrates, which are adjacent to each other, are separated from each other.