The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Oct. 13, 2009
Masaki Utsumi, Kyoto, JP;
Takahiro Kumakawa, Kyoto, JP;
Masami Matsuura, Kyoto, JP;
Yoshihiro Matsushima, Kyoto, JP;
Masaki Utsumi, Kyoto, JP;
Takahiro Kumakawa, Kyoto, JP;
Masami Matsuura, Kyoto, JP;
Yoshihiro Matsushima, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method for fabricating a semiconductor device includes: the step (a) of forming a vibrating film on a predetermined region of each of a plurality of chips included in a semiconductor wafer; the step (b) of forming, on the semiconductor wafer, an intermediate film containing a sacrifice layer located on the vibrating film of each of the chips; and the step (c) of forming a fixed film on the intermediate film. This method further includes, after the step (c), the step (d) of subjecting the semiconductor wafer to blade dicing to separate the chips, and the step (e) of removing, by etching, the sacrifice layer to provide a cavity between the vibrating film and the fixed film.