The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2010

Filed:

Nov. 21, 2007
Applicants:

Hiromi Shimazu, Kashiwa, JP;

Hiroyuki Ohta, Tsuchiura, JP;

Yohei Tanno, Hitachinaka, JP;

Mari Uchida, Tsuchiura, JP;

Naoto Saito, Kasumigaura, JP;

Inventors:

Hiromi Shimazu, Kashiwa, JP;

Hiroyuki Ohta, Tsuchiura, JP;

Yohei Tanno, Hitachinaka, JP;

Mari Uchida, Tsuchiura, JP;

Naoto Saito, Kasumigaura, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 33/00 (2006.01); G01N 37/00 (2006.01); G01N 33/18 (2006.01); G01N 33/487 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a solidification sensor for measuring a solidification state of a liquid with a high degree of accuracy in real time, and for making the sensor small-sized with a reduced power consumption, the solidification sensor comprises a liquid absorbing portion formed of a liquid absorbable material, a substrate coupled to the liquid absorbing portion and a strain sensor for measuring strain exerted to the substrate due to a volumetric change upon solidification of a liquid absorbed in the liquid absorbing portion.


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